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         BYV29B-500 All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 — 3 April 2012 4 of 11 NXP Semiconductors BYV29B-500 Ultrafast power diode 5. Thermal characteristics [1] Device mounted on a FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 3 --2.5K/W Rth(j-a) thermal resistance from junction to ambient free air in free air [1] -50-K/W Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width 001aag913 1 10?1 10 Zth(j-mb) (K/W) 10?3 ?6 10?2 tp (s) 10 10110 ?1 10?5 10?3 10?2 10?4 tp t = p T P t T δ |